Significant improvement in the interface thermal conductivity of graphene-nanoplatelets/silicone composite

Heat conducting silica gel sheets with graphene nanoplatelets (GNPs) filler prepared by high pressure homogenization were fabricated. The dispersed GNPs filler in silica gel significantly affects the thermal conductivity of GNPs silica gel sheets (GNPs-SGS). The thermal conductivity of GNPs-SGS with 5 wt% GNPs reaches 0.43 W(m k)−1 which increased by 110% and 50% comparing to the pure silica gel sheets (Pure-SGS) and graphite silica gel sheets (GP-SGS) with the same mass fraction. The efficient of heat conduction of heat-sink device which made of GNPs-SGS with 5 wt% is higher than the one which made of Pure-SGS. Besides, The temperature of the thermal plate is 22 °C lower when using 5 wt% GNPs-SGS compared to the bare one measured by thermal management simulator (TMS), proving its good heat radiation ability. FE-SEM was used to observe the fillers and the section of gel sheets, it can be clearly observed the layered and the uniform distribution of GNPs in the matrix. The facile process of high pressure homogenization to exfoliate GNPs is a feasible program for industrial production.