Optimized Design of Chips Layout in Press-Pack IGBT Module

To analyze the influence of chips layout in Press-Pack IGBT modules, the current sharing, stress and temperature distribution of two types of modules with anti-parallel diodes are simulated. The results show that the case of IGBTs evenly surrounding around the diodes ensures a better current sharing, stress and temperature distribution over a wide current range. Furthermore, the current sharing of customized Press-Pack IGBT module with two layouts is measured by PCB Rogowski coils. The results of measurement verified the simulation results in terms of current sharing.