Slurry with adjustable dielectric polishing selectivity and methods for polishing a substrate

A chemical mechanical Polieraufschlammungszusammensetzung used as original components water, an abrasive, a halogenated quaternary ammonium compound according to formula (I) wherein R is selected from a C PPE, a C Also provided are processes for preparing the chemical mechanical Polieraufschlammungszusammensetzung and for using the chemical mechanical polishing composition for polishing a substrate.