Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Creep deformation analysis of die attach materials in a discrete type power semiconductor device under the operating conditions were performed. Pressurized sintered Ag nanoparticles are superior in creep deformation resistance at any period between on time and off time and $\varepsilon_{\mathrm {in}}$ per cycle was about 60% of Sn-3.0Ag-0.5Cu alloy.