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Dynamic Stress Analysis Applied to the Underpotential Deposition of Copper Onto (111)-Textured Au
Dynamic Stress Analysis Applied to the Underpotential Deposition of Copper Onto (111)-Textured Au
2017
Gery R. Stafford
Ugo Bertocci
Keywords:
Copper
Metallurgy
Chemistry
Underpotential deposition
dynamic stress
Correction
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