Anisotropic conductive film, and connection structure using same

The present invention relates to an anisotropic conductive film comprising a conductive layer and an insulation layer, wherein each of the conductive layer and the insulation layer comprises two types of inorganic fillers having different diameters, and an increase rate in diffusion length, represented by the following formula 1, of the insulation layer is greater than that of the conductive layer when measured after preliminarily compressing the film under a condition of 50-80°C, for 1-3 seconds and at 1.0-3.0 MPa and mainly compressing the same under a condition of 120-160°C, for 3-6 seconds and at a pressure of 60-90 MPa, and the storage modulus is 2.5-5 GPa when cured at a cure rate of 90% or more. Additionally, there is an advantage of enabling insulation and connection reliability to be improved by increasing the dispersibility of conductive particles. [Formula 1] Increase rate in diffusion length (%) = [(Transverse length of the corresponding layer after main compression - Transverse length of the corresponding layer before preliminary compression) / Transverse length of the corresponding layer before preliminary compression] ×100