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Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder
Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder
2007
yanyanfu
Lifang Feng
zhangkeke
wenjiuba
Keywords:
Particle
Soldering
Creep
Composite number
Materials science
Composite material
Metallurgy
composite solder
Correction
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