Production method of the adhesive resin layer with the sheet and a semiconductor device

A while maintaining the alignment of the chip-like component, to provide a sheet having an adhesive resin layer can be transferred to the chip-like parts. Further, to provide a method of manufacturing a semiconductor device using the sheet. An adhesive resin layer-sheet according to the present invention comprises a substrate made of an adhesive resin layer laminated on the substrate, MD direction of the substrate after the heating for 1 minute at 70 ° C. and a -0.5 to 0.5% shrinkage rate in the CD direction is bending resistance of the substrate 80mm or more. .BACKGROUND