Characteristics of Cu thin film on PET by ECR-PECVD

Summary form only given, as follows. Metallized polymers were prepared at an ambient temperature by an electron-cyclotron-resonance (ECR) plasma enhanced chemical vapor deposition (PECVD) system equipped with (-)DC bias from the Cu(hfac)/sub 2/-Ar-H/sub 2/ system. Metallized polymers, and especially poly ethylene terephthalate (PET), are currently being studied and employed for microelectronic packaging, magnetic tapes, EMI shielding, etc. Copper is an attractive material for metallization thanks to its intrinsic electromigration resistance and low resistivity.