Array type placement head for high speed full-automatic placement machine

The utility model provides a high speed full automatic chip mounter array type placement head. The utility model adopts a main frame as a core and the other systems and modules of the utility model all arranged on the main frame. An air cylinder die set, an air cylinder control module, an entire Z shaft motion system form a Z motion of the placement head. When in working, the air cylinders in the air cylinder module execute the placement task in sequence and only a single air cylinder works at a certain time. A ball spline die set and a Theta control system work together to finish the offset correction of chips. When moving along the Theta direction, all splines in the ball spline die set work at the same time, and the specific offset parameter of a single spline is realized by control software. A vacuum system is used for producing a vacuum source and control signals for the blowing and drawing of the chips. The vacuum source transmits vacuum to the end of the placement head through a vacuum entrance of a micro air cylinder in the air cylinder die set, a hollow piston rod and a hollow spline shaft in the ball spline die set, thereby realizing the suction and placement of the chips.