Flip chip bonding technology using resin for adhesion

We have developed an innovative process for bonding an LSI chip with 110 μm pitch gold ball bumps on a printed circuit board (PCB) at high speed using flip chip bonding (FCB) with adhesive. To reduce the time required for bonding, a bonding tool providing a constant heat source was used for heating. We investigated bondability and reliability under various bonding conditions, and studied the FCB process adding the bonding effect with Au-Au metallic diffusion. This investigation resulted in the development of FCB technology for bonding an LSI chip onto a PCB in just 3.5 seconds using adhesive, for which various reliability tests were then applied.