Multichip Packages in the Esprit Programme

A compatible set of advanced interconnect technologies has been developed and used in the construction of high density, high speed multichip modules. The two key interconnect technologies which have been developed are tape automated bonding (TAB) to 125 um pitch and > 200 l/Os, and an additive multilayer board technology on a pcb base, with stripline signal layers suitable for GHz signals. All signal layers in this board technology have a 125 um pitch capability. Using the associated mechanical, electrical and thermal design tools that had been developed, these interconnect technologies have been proven in both high density (silicon to substrate ratio 36%) and high speed (>600 Mbit/s) multichip modules.