TXRF Applications Supporting Yield Enhancements and Tool Monitor-ing in Order to Improve the Front-End Semiconductor Processing

In this paper, we summarize how the introduction of in-line TXRF monitoring provides detailed analytical information on aluminum, titanium and molybdenum contamination levels in order to improve several process steps from front- end processing, minimize product yield loss and make it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.