Reduction of Pit and Nodule Defects on Thick Electroless Nickel Plating Film

Deposition of a heavier coating requires more careful attention to process control to prevent nodules and pitting. Electroless nickel plating is sensitive to deficiencies such as pit, pinhole and nodules. These defects are generally caused by the bath ingredients and operating conditions. This study specifically examined that the defects free electroless Ni-P deposits for heavy coating. Results of our investigation show that selection of complexing agent, elimination of insoluble particles from the plating solution using fine filtration, selection of pH adjustor and operating conditions are critical factors to avoid these defects.