Encapsulation for an organic electronic device, an organic electronic device with the encapsulation and a process for producing an organic electronic device with the encapsulation

It is specified with a layer sequence of an encapsulation for an organic electronic component, comprising the following layers: - at least one thin-film encapsulation, - at least a first adhesive layer disposed on the at least one thin-film encapsulation, wherein the first adhesive layer comprises at least a getter material and - a cover layer disposed on the first adhesive layer. Furthermore, an organic electronic component with such encapsulation and a process for producing such an organic electronic device are described.