Housing and manufacturing method thereof electronics

The present invention aims to provide a manufacturing yield and decorativeness (decoration property) superior electronics housing. Electronic equipment enclosure of the present invention is characterized by comprising: a metal housing for housing the electronic device therein and a resin film coated on the metal housing. Furthermore, between the resin layer and the metal housing in the resin film, embodiments comprising at least one of the adhesive layer and the printing layer, a resin film, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate ( PMMA), and the like aspects that include any of the thermoplastic resins of polylactic acid (PLA) is preferred.