Manufacture of transparent conductive wiring film substrate

PURPOSE:To simplify the manufacturing step by changing the method of manufacturing a transparent conductive film wiring substrate into a dry type one. CONSTITUTION:(a) A SiO2 layer 2 is provided on a substrate 1. (b) A conductive black film 3 is formed on the SiO2 layer 2. (c) The conductive black film 3 is formed with the use of a laser being emitted from an output horn 4, and (d) cutting is performed to a desired cutting pattern. The metal which has been vaporized by action of laser is sucked by a vacuum suction head 5. (e) The substrate 1 is caused to undergo combustion to cause the oxidization and crystallization of the wiring patterned conductive black film 3, thereby producing a wiring-patterned transparent conductive film 6.