Adhesive and connecting structure using the same

The present invention provides the use of an adhesive and a connection structure of the adhesive. The present invention provides a circuit member connecting adhesive comprising (a) a thermoplastic resin, (b) which is solid below 30 ℃ radical polymerizable compound, (c) a radical polymerization initiator, (d) in the molecule the vinyl compound having at least one or more phosphate groups, and urethane (meth) acrylate oligomer, (b) which is solid below 30 ℃ radical polymerizable compound comprises epoxy acrylate, (b) 30 the content of the polymerizable compound as a solid free-radical ℃ less with respect to 100 parts by mass of the (a) thermoplastic resin is 5 to 100 parts by mass.