Arrangement of an electrical component on a substrate and method of manufacturing the arrangement

The invention relates to an arrangement with at least one substrate (1), arranged at least one on a surface portion (11) of the substrate electrical component (2) having an electrical contact surface (21) and at least one electrical contact tab (3) having an electrical connection face (32 ) for electrically contacting the contact surface of the device, wherein the connecting surface of the contact tab and the contact surface of the component are connected such that an addition, projecting over at least the contact surface of the component region (33) of the contact lug provided. The arrangement is characterized in that the contact tab has at least one electrically conductive foil (30) and the electrically conductive film, the electrical connection surface of the contact lug. The invention is used particularly for large-area, low-inductance contact of power semiconductor chips, which allows a high current density.