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Research on Flip Chip Bonding Process and Thermal Cycle Reliability Simulation of 3D Stacked Structure
Research on Flip Chip Bonding Process and Thermal Cycle Reliability Simulation of 3D Stacked Structure
2021
Mingming Chen
Yuexin Zhang
Yuhua Guo
Tianxiang Wu
Long Dou
Wenya Tian
Jinqing Xiao
Junhui Li
Keywords:
Flip chip
Mechanical engineering
Reliability (semiconductor)
bonding process
thermal cycle
Materials science
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