Ni-COATED COPPER POWDER, CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING SAME, AND METHOD FOR MANUFACTURING Ni-COATED COPPER POWDER

Provided is a Ni-coated copper powder which increases the number of contact points between Ni-coated copper powder particles, thereby ensuring excellent conductivity and preventing agglomeration between the copper powder particles. Thus, the Ni-coated copper powder may be preferably used for conductive pastes, electromagnetic shields or the like. The Ni-coated copper powder according to the present invention is formed via the agglomeration of copper particles having specific shapes and Ni- or Ni alloy-coated surfaces into a dendritic shape or an agglomerate of the copper particles. This Ni-coated copper powder has a larger number of contact points between copper powder particles and thus exhibits excellent conductivity.