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In-situ Stress behavior of Cu thin films during thermal evaporation
In-situ Stress behavior of Cu thin films during thermal evaporation
2007
Sang Ryu
Gyeong-Cheon Lee
Seung-Geun O
Yeong-Man Kim
Keywords:
Composite material
Materials science
in situ stress
Evaporation (deposition)
Thin film
Correction
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