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A Predictive Model of Wafer Nonuniformity for Chemical Mechanical Polishing Process Considering a Retaining Ring Mechanism
A Predictive Model of Wafer Nonuniformity for Chemical Mechanical Polishing Process Considering a Retaining Ring Mechanism
2012
Yeou-Yih Lin
Ship-Peng Lo
Shien-Yang Lin
C.S. Chiou
Keywords:
Materials science
Chemical-mechanical planarization
Retaining ring
Wafer
Composite material
Correction
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