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Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere
Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere
2021
Ying Meng
Yang Xu
Runhua Gao
Xinhua Wang
Xiaojuan Chen
Sen Huang
Ke Wei
Dahai Wang
Haibo Yin
Kai Takeuchi
Tadatomo Suga
Fengwen Mu
Xinyu Liu
Keywords:
Materials science
FOIL method
Polyimide
Chemical engineering
Atmosphere
Formic acid
Catalysis
Correction
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