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A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits
A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits
2021
Liang-Yu Chen
Philip G. Neudeck
David J. Spry
Glenn M. Beheim
Gary W. Hunter
Keywords:
Integrated circuit
Optoelectronics
Materials science
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