Non-Polar SiC Crystal Growth with m-Plane(1-100) and a-Plane(11-20) by PVT Method

The present research was focused to produce 2 inch wafers from small rectangular seeds and to investigate the quality of non-polar SiC substrates grown by a conventional PVT method. The non-polar SiC seeds were prepared by cutting along direction of 6H-SiC crystal grown on (0001) basal plane. As SiC ingot grows, many defects in connected region were gradually diminished. While the full width at half maximum (FWHM) values of m-plane SiC substrate measured along a-direction and c-direction were 60 arcsec and 70 arcsec, respectively, and the FWHM values of a-plane SiC substrate measured along m-direction and c-direction were 27 arcsec and 31 arcsec respectively. The stacking faults lying in the basal plane can be detected by molten KOH etching as linear etch pits extending along on the (11-20) surface and the carrier concentration was observed by Raman spectrum.