High Temperature-Resistant Spin-On Adhesive for Temporary Wafer Mounting Using an Automated High-Throughput Tooling Solution

This paper reviews a high temperature–resistant spin-on adhesive platform and the equipment solution used to apply the adhesive to a wafer, temporarily bond the wafer to a carrier, and debond the thinned wafer in an automated high-throughput method. The focus of this paper is on the physical and chemical properties of the spin-on adhesive material that enable an automated process. The information included here covers process flow, application parameters, equipment setup, TGA, coating total thickness variation (TTV), rheology analysis, transparency plots, experimental procedure of Brewer Science material on EVG ® 850 tool, and postbonding TTV values on 150-mm and 200-mm substrates. Throughput numbers achieved with the WaferBOND™ HT 220 adhesive and EVG equipment solution are given.