Mounting system of electronic components and assembly processes for electronic components

A challenge that arises, the invention is to provide a mounting system for electronic components and a method of mounting electronic components that allow the appropriate selection of a plurality of pick-and-operating in accordance with a characteristic of a production target and which are flexible and extraordinary production efficiency respectively. A mounting system for electronic components that is configured by a plurality of inspection coating machines (M1) and a plurality of mounting devices (M2) to (M4) for electronic components are connected to each other, each having a first mounting lane (L1) and a second mounting lane (L2) which is configured so that it is able to either carry out an operation execution operation execution mechanism, while only one carrier material of a substrate conveyance mechanism as a target is taken corresponding to the operation execution mechanism a first operating mode, and a second mode of operation in which an operation performance mechanism can perform an operation performance, while all of a plurality of substrates which are transported by a plurality of substrate transport mechanisms are taken as targets to be executed and only those with egg nem test head (15) and an applicator head (16) equipped inspection coating machine (M1) is brought into the second operating mode.