Very high‐efficiency semiconductor wafer‐bonded transparent‐substrate (AlxGa1−x)0.5In0.5P/GaP light‐emitting diodes

Data are presented demonstrating the operation of transparent‐substrate (TS) (AlxGa1−x)0.5In0.5P/GaP light‐emitting diodes (LEDs) whose efficiency exceeds that afforded by all other current LED technologies in the green to red (560–630 nm) spectral regime. A maximum luminous efficiency of 41.5 lm/W (93.2 lm/A) is realized at λ∼604 nm (20 mA, direct current). The TS (AlxGa1−x)0.5In0.5P/GaP LEDs are fabricated by selectively removing the absorbing n‐type GaAs substrate of a p‐n (AlxGa1−x)0.5In0.5P double heterostructure LED and wafer bonding a ‘‘transparent’’ n‐GaP substrate in its place. The resulting TS (AlxGa1−x)0.5In0.5P/GaP LED lamps exhibit a twofold improvement in light output compared to absorbing‐substrate (AS) (AlxGa1−x)0.5In0.5P/GaAs lamps.