A method for connecting printed circuit boards

A method for connecting printed circuit boards, comprising the steps of: Forming a first conductive structure (13) containing a first plurality of contact pads (13a) on a first made of a thermoplastic resin printed circuit board (5); Forming a second conductive structure (11) containing a second plurality of contact pads (11a) on a second printed circuit board (2); Applying solder (14, 7, 8) on at least one side of the first plurality of contact pads (13a) and the second plurality of contact pads (11a); Overlapping the first plurality of contact pads (13a) with the second plurality of contact pads (11a); and is formed by pressurizing and heating a joining portion formed by the overlapping area of ​​the first printed circuit board (5) and the second printed circuit board (2) at a predetermined temperature to the first plurality of contact pads (13a) and the second plurality of contact pads ( 11a) through the solder (14, 7 to connect 8) and electrically ...