Printed circuit board with electronic components embedded therein including cooling member and method for fabricating the same

PURPOSE: An electronic component embedded PCB and a manufacturing method thereof are provided to connect a heat dissipation member to an inner circuit layer, which functions as a ground layer, by attaching the heat dissipation member to a ground pad. CONSTITUTION: A core substrate(112) comprises a punched cavity and an internal layer circuit layer. An electronic component(116) having a pad part is installed inside the cavity. A heat dissipation member(124) is attached to the different side of the electronic component through a conductive material. The heat dissipation member is connected to the internal layer circuit layer. An outer layer insulating layer(120,126) is laminated on both sides of the core substrate in order to cover the electronic component. An outer layer circuit layer(130) is connected to the pad part or the internal layer circuit layer through an outer layer via.