Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method

The present invention provides a treated surface copper foil, which adheres favorably to resin and achieves excellent visibility when observed through the resin. Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the color difference (∆E*ab) based on JIS Z8730 of the through-polyimide surface of a copper-clad laminate, configured by laminating treated surface copper foil on a polyimide with a ∆B(PI) before bonding to the copper foil of 50 to 65, is at least 50. When the copper foil is photographed with a CCD camera through the polyimide, which has been laminated from the surface on which surface treatment has been performed, ∆B (∆B = Bt - Bb) in the observation point-brightness graph is at least 40. The ten-point mean roughness (Rz) of TD of the other surface of the treated surface copper foil measured with a laser microscope in which the wavelength of the laser light is 405 nm is at least 0.35 µm.