Future of PECVD and spin-on ultra low-k materials
2011
A few years ago, we developed at the IBM Almaden Research Center, the concept of introducing carbon in low-k materials in the form of bridging units between the silicon atoms and not as a pendant methyl group. Since then, this strategy has been widely adopted among the semi-conductor industry and the most advanced spin-on and PECVD ULK materials are now based on this model. This paper addresses the concept of designing ultra low-k bridged materials to achieve the best mechanical properties, to control the pore size and connectivity and to prevent plasma damage.
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