Practical multi-fibre array packaging technology

Most published data to date on fibre array alignment, especially for motherboard components, has been based on the use of silicon v-groove technology to position the fibres and this can give a fibre-to-fibre positional accuracy of a micron or so, assuming that is, that the fibre being used has a tight manufacturing tolerance of 0.51 /spl mu/m for both concentricity and diameter. Work at BT Labs has concentrated on the adaption of standard single device packaging technology for device arrays up to the 1x4 level, and the use of the MT (mechanically transferable) fibre connector for 1x4 devices. >