Via structure and method

An apparatus comprising a through hole formed in the substrate. Vias coupled between the first side and the second side of the substrate. The through hole comprising a bottom portion adjacent to a second side of the substrate, wherein the bottom is formed of a conductive material. The through hole further includes a side wall portion formed of a conductive material and a middle portion formed between the side walls, wherein the middle is formed of a dielectric material. The present invention also provides a method and structure of the through hole.