Chip LED and manufacturing method thereof

The invention discloses a chip LED and a manufacturing method thereof. The chip LED comprises a substrate and an LED chip. The substrate comprises a body, a front circuit layer on the upper surface of the body, a back circuit layer on the lower surface of the body, conducing vias on the body, and connecting circuit layers, wherein the connecting circuit layers used for electrically connecting the front circuit layer and the back circuit layer are arranged in the conducting vias. The LED chip is mounted on the front circuit layer by die bonding and wire bonding. The conducting vias are filled with rosin. The manufacturing method includes the sequential steps of substrate manufacturing, rosin filling, die bonding and wire bonding, baking, and cutting. By the use of the chip LED and the manufacturing method thereof, excessive glue can be avoided in compression molding process and product quality can be improved.