Epoxy resin compound, and, prepreg and clad copper laminate manufactured using the compound

The present invention relates to an epoxy resin compound, and, a prepreg and clad copper laminate manufactured using the compound. The epoxy resin compound comprises the following constituents: an epoxy resin having in the molecular chain thereof three or more epoxy groups and having a nitrogen element, a phosphate compound, and an active ester curing agent. The amount of the epoxy resin having in the molecular chain thereof three or more epoxy groups and having a nitrogen element is 100 parts by weight, the amount of the phosphate compound is 5 to 50 parts by weight, and the equivalent ratio of the amount of the active ester curing agent, calculated in epoxy equivalent and active ester equivalent ratio, is 0.85 to 1.2. The prepreg and clad copper laminate manufactured using the epoxy resin compound are provided with excellent dielectric properties and moisture/head resistances, also are provided with high vitrification transition temperatures, reduced water absorption rate, while at the same time implement halogen-free flame retardation, and achieve UL 94V-0.