Reliability evaluation of electronic devices

Abstract Stresses due to thermal oxidation and film deposition processes during the fabrication of a semiconductor are analysed. The strengths of plastic encapsulants, silicon chips, bonding wires and adhesive interfaces in integrated-circuit (IC) plastic packages are evaluated using fracture mechanics and other techniques. The thermal fatigue strength of solder joints is then estimated using the fatigue test data of solder specimens and simplified modelling of IC packages.