Research Progress in Copper Matrix Composites for Electronic Packaging

Copper matrix composite is a type of important material for electronic packaging,which can fulfill the requirements of quick and substantive heat dissipation for high power devices.Performance,preparation methods and issues in application of Cu/W and Cu/Mo traditional packaging materials,Cu/C fiber packaging materials,Cu/Invar(Mo,Kovar)/Cu layer-structured packaging materials,Cu/ZrW2O8(TiNi)negative thermal expansion packaging materials,and Cu/SiC and Cu/Si low-density packaging materials are reviewed in this paper.Moreover,it's predicted that lightweight Cu/Si composites will be a prospective direction for the R D of novel copper matrix packaging materials.