The packaging system and method for manufacturing
2011
A packaging system, comprising: a first substrate structure includes at least a first conductive structure over the first substrate; and a second substrate structure including a second substrate, a first and a second substrate structure It engages the substrate structure, wherein the at least a first conductive structure by at least one germanium-containing layer and the second substrate are electrically connected. The present invention also provides a method for producing and packaging system.
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