Method for manufacturing electrostatic chuck

The present invention relates to a method for manufacturing an electrostatic chuck and, more specifically, to a method for manufacturing an electrostatic chuck comprising a first step of inserting molybdenum (Mo) contact terminals on the top and bottom surfaces of an aluminum nitride (AIN) substrate at predetermined depths to be sintered with the AlN substrate; a second step of depositing conductive films on the top and bottom surfaces of the AIN substrate to form film layers; a third step of photo-etching the film layers deposited on the top and bottom surfaces of the AIN substrate to form electrode patterned layers, respectively; a fourth step of charging AIN powder on the top and bottom surfaces of the AIN substrate, on which the electrode patterned layers are formed, to be sintered on the AIN substrate; a fifth step of forming contact terminal holes by machining the holes from the bottom surface of the AIN substrate to the bottom of the contact terminals; and a sixth step of inserting one among Mo and Kovar terminals in the machined contact terminal holes to be brazed on the bottom of the contact terminals. The present invention can reduce manufacturing costs with a simple manufacturing process because an electrostatic electrode pattern and a heater electrode pattern are integrally formed on the top and bottom surfaces of the basic material of the AIN substrate at once.