Diffusion barrier and electrical characteristics of a self-aligned MgO layer obtained from a Cu(Mg) alloy film

Diffusion barrier characteristics and electrical properties of self-aligned MgO layers obtained from a Cu(Mg) alloy film have been investigated. Self-aligned surface and interfacial MgO layers were formed upon annealing a Cu(Mg) film in an oxygen ambient and prevented interdiffusion of Cu in SiO2 up to 700 °C. The thermal stability of a pure Cu/TiN/Si multilayer system has been significantly enhanced up to 800 °C by the MgO layers by forming a MgO/Cu/MgO/TiN/Si multilayer system. A combined structure of Si3N4(500 A)/MgO(100 A) increased the breakdown voltage up to 20 V from 15 V and reduced the leakage current density down to 3×10−9 A/cm2 from 1×10−8 A/cm2 compared to a pure copper system. Consequently, the deposition of Cu(Mg) alloy followed by annealing in an oxygen ambient gives rise to the formation of a self-aligned MgO layer with excellent diffusion barrier and electrical characteristics and the film can be applied as a gate electrode in thin-film transistor/liquid-crystal displays, resulting in a r...