Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates

The invention discloses a solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates. According to the solvent material formula, a solvent in an adhesive layer is prepared by stirring and mixing polydimethylsiloxane, alkyl phenol polyoxyethylene ether, glycerol monoester stearate, polyvinyl alcohol, arabia gum, dimethyl imidazole, diethylenetriamine, dimethyl glutarate, di-ethylene glycol di-butyl ether and polyacrylamide under normal temperature and normal pressure. When the prepared solvent is used in a production process of copper-clad plates, dielectric properties and mechanical properties of the copper-clad plates can be improved; the service life of the adhesive layer is prolonged; the service performance of the adhesive layer is improved; the curing time of the adhesive is easy to master; the adhesion of the adhesive is improved.