Efficient Fault and Defect Localization Through Multiple Emission Site Analysis

Rapid development in semiconductor processes adds a challenge in performing failure analysis of ICs, In the past, straightforward and traditional fault isolation and physical failure analysis leads to determination of faulty devices and defects of short and leakage failures. This method does not apply to open failures and other failure modes showing multiple emission spots thus different approaches are devised to efficiently and effectively pinpoint faults and defects with minimum failure analysis time. This paper discusses the incorporation of software-based analysis with fault isolation techniques for defect localization and root cause identification. Two case studies successfully highlight efficient fault and defect localization through multiple emission site analysis with the use of Avalon software.