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Low‐temperature ultrasound‐activated joining of ZrO2 ceramics using Sn–Al–Cu solder
Low‐temperature ultrasound‐activated joining of ZrO2 ceramics using Sn–Al–Cu solder
2019
Hongjie Dong
Z.L. Li
Xiaoguo Song
Xiajun Guo
Yanxu Luo
Tiansheng Bai
Shoujing Wei
Hongyun Zhao
Jiuchun Yan
Jicai Feng
Keywords:
Composite material
Ceramic
Soldering
Materials science
Ultrasound
Correction
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