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Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C
Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C
2020
Pradeep Lall
Yunli Zhang
Haotian Wu
Edward W. Davis
Jeffrey C. Suhling
Keywords:
Electronic component
Degradation (geology)
Electronic packaging
Elongation
Ultimate tensile strength
Composite material
Elastic modulus
Operating temperature
Isothermal process
Correction
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