A miniature ultra low-power 2.5 GHz downconverter IC for wireless communications

A new era of wireless communication systems (cordless telephones, cellular telephones, PCN, PCS, etc.) has emerged. Such systems will require high portability, low power, and low cost. To satisfy such requirements, an 18 mW (3 V, 6 mA) 2.5 GHz Si downconverter IC has been developed. The chip is housed in a surface mount 6-pin plastic mold package which measures only 2.9 mm × 1.8 mm. For battery powered systems, a power-save function has been included which reduces I cc down to nanoampere levels. An overall conversion gain of 14.3 dB was achieved while maintaining an 11.5 dB noise figure