Spreading Resistance in Multilayered Orthotropic Flux Channel with Temperature-Dependent Thermal Conductivities

Anisotropic materials have received remarkable attention in the development of microelectronic devices. In many materials, the thermal conductivities are temperature-dependent and usually are approximated by constant thermal conductivities when considering thermal analysis. In this paper, analytical solutions of the temperature rise and the thermal resistance of a multilayered three-dimensional flux channel with orthotropic temperature-dependent thermal conductivities are addressed by means of the Kirchhoff transform, which is considered as a powerful method for dealing with nonlinear conduction problems with temperature-dependent thermal conductivities. A single eccentric heat source is considered in the source plane of the flux channel, where heat enters the system and flows by conduction through the layers to reach a convective heat sink with uniform heat transfer coefficient. The solutions are extended to account for multiple eccentric heat sources in the source plane. Further, the analytical solution...