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Post-packaging simulation based on MOSFET characteristics variations due to resin-molded encapsulation
Post-packaging simulation based on MOSFET characteristics variations due to resin-molded encapsulation
2020
Naohiro Ueda
Hirobumi Watanabe
Keywords:
MOSFET
Engineering
Electronic engineering
Encapsulation (computer programming)
Optoelectronics
simulation based
Correction
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