InP laser sources optimised for integration to SiPh circuits

Integration of InP laser sources is a key enabling technology for Silicon Photonics and requires customised InP chips that meet the mechanical and optical requirements of a diverse range of Si Photonics architectures. The Sivers Photonics InP100 Platform is a common design and manufacturing framework for InP photonics devices that uses established process modules to produce a broad range of device types on 100mm wafers. This approach reduces cycle times for the development of customised device designs, has proven reliability, and is scalable to high volume manufacturing. The InP100 platform enables integration of customised InP chips with Si Photonics chips (e.g. via flip chip bonding), for applications for applications such as LIDAR, sensing and communications.